semiconductor technical data 2238 rev 5 ? motorola, inc. 1996 3/93
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! the mc10H158 is a quad two channel multiplexer with common input select. a ahigho level select enables input d00, d10, d20 and d30 and a alowo level select enables input d01, d11, d21 and d31. this mecl 10h part is a functional/pinout duplication of the standard mecl 10k family part, with 100% improvement in propagation delay and no increase in powersupply current. ? propagation delay, 1.5 ns typical ? power dissipation, 197 mw typical ? improved noise margin 150 mv (over operating voltage and temperature range) ? voltage compensated ? mecl 10kcompatible maximum ratings characteristic symbol rating unit power supply (v cc = 0) v ee 8.0 to 0 vdc input voltage (v cc = 0) v i 0 to v ee vdc output current e continuous e surge i out 50 100 ma operating temperature range t a 0 to +75 c storage temperature range e plastic e ceramic t stg 55 to +150 55 to +165 c c electrical characteristics (v ee = 5.2 v 5%) 0 25 75 characteristic symbol min max min max min max unit power supply current i e e 53 e 48 e 53 ma input current high pin 9 pins 36 and 1013 i inh e e 475 515 e e 295 320 e e 295 320 m a input current low i inl 0.5 e 0.5 e 0.3 e m a high output voltage v oh 1.02 0.84 0.98 0.81 0.92 0.735 vdc low output voltage v ol 1.95 1.63 1.95 1.63 1.95 1.60 vdc high input voltage v ih 1.17 0.84 1.13 0.81 1.07 0.735 vdc low input voltage v il 1.95 1.48 1.95 1.48 1.95 1.45 vdc ac parameters propagation delay data select t pd 0.5 1.0 1.9 2.9 0.5 1.0 1.9 2.9 0.5 1.0 2.0 2.9 ns rise time t r 0.7 2.2 0.7 2.2 0.7 2.2 ns fall time t f 0.7 2.2 0.7 2.2 0.7 2.2 ns note: each mecl 10h series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. the circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 iinear fpm is maintained. outputs are terminated through a 50ohm resistor to 2.0 volts. dip pin assignment q0 q1 d11 d10 d01 d00 nc v ee v cc q2 q3 d20 d21 d30 d31 select 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 truth table select d0 d1 q lll x lhh x hxl l hxh h l suffix ceramic package case 62010 p suffix plastic package case 64808 fn suffix plcc case 77502 pin assignment is for dualinline package. for plcc pin assignment, see the pin conversion tables on page 611 of the motorola mecl data book (dl122/d).
mc10H158 2239 motorola mecl data dl122 e rev 6 logic diagram v cc = pin 16 v ee = pin 8 select 9 d0 1 5 d0 0 6 d1 1 3 d1 0 4 d2 1 12 d2 0 13 d3 1 10 d3 0 11 1 q0 2 q1 15 q2 14 q3
mc10H158 motorola mecl data dl122 e rev 6 2240 outline dimensions fn suffix plastic plcc package case 77502 issue c notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). m n l y brk w v d d s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t x g1 b u z view dd 20 1 s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) t seating plane s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t h view s k k1 f g1 dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 1.02
mc10H158 2241 motorola mecl data dl122 e rev 6 outline dimensions p suffix plastic dip package case 64808 issue r notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. a b f c s h g d j l m 16 pl seating 18 9 16 k plane t m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 l suffix ceramic dip package case 62010 issue v notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension f may narrow to 0.76 (0.030) where the lead enters the ceramic body. a b t f e g n k c seating plane 16 pl d s a m 0.25 (0.010) t 16 pl j s b m 0.25 (0.010) t m l dim min max min max millimeters inches a 0.750 0.785 19.05 19.93 b 0.240 0.295 6.10 7.49 c 0.200 5.08 d 0.015 0.020 0.39 0.50 e 0.050 bsc 1.27 bsc f 0.055 0.065 1.40 1.65 g 0.100 bsc 2.54 bsc h 0.008 0.015 0.21 0.38 k 0.125 0.170 3.18 4.31 l 0.300 bsc 7.62 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.01 16 9 18 motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. how to reach us: usa / europe / locations not listed : motorola literature distribution; japan : nippon motorola ltd.; tatsumispdjldc, 6f seibubutsuryucenter, p.o. box 20912; phoenix, arizona 85036. 18004412447 or 6023035454 3142 tatsumi kotoku, tokyo 135, japan. 038135218315 mfax : rmfax0@email.sps.mot.com t ouchtone 6022446609 asia / pacific : motorola semiconductors h.k. ltd.; 8b tai ping industrial park, internet : http://designnet.com 51 ting kok r oad, tai po, n.t., hong kong. 85226629298 mc10H158/d
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